Inspection System Example
Wafer Inspection System and Cryogenic Wafer Probe Testing
Optical inspection of component plating and automated probe testing of superconducting devices at cryogenic temperatures.
Sciotex built two systems for semiconductor and electronic components. A chip inspection system measures the uniformity, size and shape of connector plating and searches it for defects against a known good part. Wafer inspection and probe software automates testing of silicon wafers containing superconducting devices at cryogenic temperatures in high vacuum.
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Example Overview
Inspection and Probe Testing for Semiconductors
What are wafer inspection and wafer probe testing?
Semiconductor and electronic component makers inspect and test devices before they are packaged or shipped. Optical inspection checks physical features such as plating, size and shape. Wafer probe testing makes electrical contact with each device on the wafer to measure how it performs. Superconducting devices add a further challenge: they only work at cryogenic temperatures, so they must be probed cold and in high vacuum.
The chip inspection system compares every unit under test with a known good part for its model number, measuring the plating on its connectors and flagging defects. The wafer probe software automates electrical testing of superconducting devices on silicon wafers across cryogenic temperature ranges.
At a glance
- Chip inspection
- Plating uniformity, size, shape and defects on component connectors
- Reference
- Each unit compared with a known good part for its model
- Wafer testing
- Automated testing of superconducting devices on silicon wafers
- Environment
- Cryogenic temperature ranges, high vacuum
- Sciotex role
- Inspection and probe control software
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How It Works
How the Inspection and Probe Systems Work
Optical inspection catches physical defects; probe testing catches electrical ones. Together they cover what a device needs before it moves on.
The known good part and limits for the model are loaded.
Connector plating is captured for analysis.
Uniformity, size, shape and defects are measured.
Wafer devices are tested cold in high vacuum.
Results are stored for each unit and device.
What the System Does
Software Built for Semiconductor Inspection and Test
Both systems are built around precise comparison and automated sequences, so results are consistent from part to part.
Golden-part comparison
Each unit is judged against a known good part for its model number.
Plating defect detection
Defects in connector plating are found and measured.
Cryogenic wafer probing
Superconducting devices are tested in their operating conditions.
Automated test sequences
Wafer testing and probe control run without manual steps.
Hardware and Software
System Capabilities
The two systems combine machine vision measurement with automated electrical test. See automated dimensional inspection for related inspection methods.
| Chip inspection | Plating uniformity, size and shape |
|---|---|
| Defects | Plating defects on component connectors |
| Reference | Known good part per model number |
| Wafer devices | Superconducting devices on silicon wafers |
| Test environment | Cryogenic temperature ranges, high vacuum |
| Automation | Automated wafer testing and probe control |
Inspection plus electrical test
Many semiconductor and electronics lines need both optical inspection and electrical test. These systems cover:
- Visual plating and dimensional checks
- Electrical probe testing on the wafer
- Results tied to each unit or device
Need semiconductor or component inspection?
Sciotex builds inspection and test systems for electronic components and wafers, combining vision, motion and automated test.
Inspecting or Testing Semiconductor Devices?
Talk to a Sciotex engineer about wafer, chip and component inspection and test systems.
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