This Chip Inspection System measures the uniformity, size, shape, and searches for defects in the plating of the connectors of electronic components.
Each Unit Under Test (UUT) is compared to a known good part for that particular model number.
This Chip Inspection System measures the uniformity, size, shape, and searches for defects in the plating of the connectors of electronic components.
Each Unit Under Test (UUT) is compared to a known good part for that particular model number.
The Wafer Inspection System and Probe Software is for automated testing of silicon wafers containing superconducting devices in cryogenic temperature ranges in high-vacuum environments.
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